Substrate processing apparatus and substrate processing method

A substrate processing method, wherein an upper surface of a substrate is processed with a processing liquid supplied from a processing liquid discharge unit including a center portion discharge port that opens on an opposed surface being opposed to the upper surface of the substrate and that opposes to a center portion of the upper surface of the substrate, and a peripheral portion discharge port that opens on the opposed surface and that opposes to a peripheral portion of the upper surface of the substrate,

• the substrate processing method including:
• a substrate rotating step of rotating the substrate around a vertical rotational axis running through the center portion, and
• a processing liquid discharging step of, simultaneously with the substrate rotating step, discharging the processing liquid from the center portion discharge port to supply the processing liquid between the substrate and the opposed surface, and discharging the processing liquid from the peripheral portion discharge port to replenish the processing liquid between the substrate and the opposed surface, so as to fill a space between the substrate and the opposed surface with the processing liquid,
• wherein the processing liquid discharge unit includes a liquid reservoir that is capable of accumulating the processing liquid to be discharged from the peripheral portion discharge port, and
• the liquid reservoir is situated above the peripheral portion discharge port, an interior of the liquid reservoir and the peripheral portion discharge port are connected via a connecting hole, and the processing liquid accumulated in the liquid reservoir is discharged from the peripheral portion discharge port via the connecting hole by reduction in pressure in the connecting hole, as fluid is distributed between the peripheral portion of the upper surface of the substrate and a surrounding region of the peripheral portion discharge port on the opposed surface.