Semiconductor device and corresponding method

A semiconductor device, comprising:

• a leadframe comprising a die pad and a set of electrically conductive leads;
• a semiconductor die having a first surface and a second surface opposed to the first surface, the semiconductor die being arranged on the die pad with said first surface facing away from the die pad;
• an electrical coupling between the semiconductor die and said electrically conductive leads;
• a containment structure on the first surface of the semiconductor die, said containment structure comprising a peripheral wall configured to define a closed perimeter around a portion of said first surface of the semiconductor die;
• stress absorbing material on the first surface of the semiconductor die and contained by the containment structure within said closed perimeter;
• and
• package molding material molded over the semiconductor die, the containment structure and the stress absorbing material.