Resin protection member forming apparatus

A resin protection member forming apparatus, comprising:

• a stage having a resin placement surface on which a particulate thermoplastic resin is to be placed;
• a wafer holding unit that has a wafer holding surface facing the resin placement surface and holds a wafer by the wafer holding surface;
• an up/down moving mechanism configured to relatively move the stage and the wafer holding unit in an up/down direction vertical to the resin placement surface;
• and
• a control unit,
• wherein the stage includes
• a Peltier device disposed inside the stage and having an upper surface and a lower surface, the upper surface being parallel and close to the resin placement surface, the lower surface being far from the resin placement surface,
• a direct current power source that supplies a direct current to the Peltier device, and
• a switch that changes a direction of the direct current to be supplied to the Peltier device, between a first direction to heat the upper surface of the Peltier device and a second direction, opposite to the first direction, to cool the upper surface of the Peltier device, and
• wherein the control unit controls the switch to cause the direct current to flow in the first direction so that the upper surface of the Peltier device is heated to melt the thermoplastic resin placed on the resin placement surface and that the resulting molten resin is pressed and spread over an entire surface of one side of the wafer between the resin placement surface and the one side of the wafer, and
• then controls the switch to cause the direct current to flow in the second direction so that the upper surface of the Peltier device is cooled to solidify the resin pressed and spread between the resin placement surface and the one side of the wafer and that a protection member is formed on the entire surface of the one side of the wafer.