Etching apparatus and etching method thereof
AssigneeWinbond Electronics Corp.
InventorsShih-Chieh Lin, Shuen-Hsiang Ke
Life of this patent
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AssigneeWinbond Electronics Corp.
InventorsShih-Chieh Lin, Shuen-Hsiang Ke
Estimating the term…
An etching apparatus and an etching method thereof are provided. An end point detector detects a light intensity at a specific wavelength for light generated when an etching process is performed on a material to be processed, and generates an end point detection signal. The material to be processed includes a material layer and at least one mask layer formed on the material layer. A control device determines an etching completion time of the mask layer according to the end point detection signal, calculates a thickness of the mask layer according to the etching completion time, and adjusts an etching time of the material layer according to the thickness of the mask layer.
An etching apparatus, comprising:
Dependencies are inferred from the claim text.