Plasma processing apparatus

A plasma processing apparatus for performing a plasma process on a substrate in a processing chamber, the apparatus comprising:

• a mounting table on which the substrate is mounted, the mounting table being provided in the processing chamber;
• a plasma generation unit arranged opposite to the mounting table through a dielectric window, the plasma generation unit including a high frequency antenna for converting a processing gas supplied into the processing chamber into plasma by an inductive coupling;
• a shield member that surrounds a space where the high frequency antenna is arranged;
• and
• a high frequency power supply for supplying a high frequency power, the high frequency power supply being capable of changing a frequency of the high frequency power,
• wherein the plasma generation unit includes:
• the high frequency antenna formed of a vortex coil having open ends at an inner end and an outer end, and including, at a central portion of a line along the high frequency antenna between the open ends, a supply point of the high frequency power supplied from the high frequency power supply and a grounding point, wherein the high frequency antenna includes a first high frequency antenna element from one open end to the supply point, a second high frequency antenna element from the other open end to the grounding point, and a connection portion through which the first high frequency antenna element and the second high frequency antenna element are connected to each other;
• an annular coil arranged not to be connected to the high frequency antenna and not to be connected to the high frequency power supply;
• and
• an impedance adjustment unit configured to adjust impedance of the impedance adjustment unit when the frequency of the high frequency power is changed such that the first high frequency antenna element and the second high frequency antenna element have different resonant frequencies from each other,
• wherein a line length of the connection portion is adjusted to determine a distribution ratio of the high frequency power to the first high frequency antenna element and the second high frequency antenna element.