Multilayer broadband ceramic capacitor with internal air gap capacitance

A capacitor comprising:

• a substantially monolithic dielectric body comprising a plurality of dielectric layers;
• a plurality of conductive first layers disposed within the dielectric body between the dielectric layers and electrically connected to a first conductive contact on the dielectric body;
• a plurality of conductive second layers disposed within the dielectric body between the dielectric layers and electrically connected to a second conductive contact on the dielectric body, the plurality of second layers interleaved with the plurality of first layers and separated by the dielectric layers to form capacitances between the layers;
• and
• at least one set of first and second conductive plates separated by a void, the void partially enclosed by the dielectric body and bordered by at least a portion of a first dielectric layer, a portion of a second dielectric layer and adjacent edges of first and second conductive plates, the first and second conductive plates being spaced apart to form a nonconductive capacitive connection through the void.

A method of making a monolithic ceramic capacitor containing at least one air gap capacitance, the method comprising:

• providing a plurality of layers of a dielectric ceramic;
• providing a plurality of conductive layers;
• stacking the conductive and dielectric layers in an interleaving fashion;
• sintering the interleaved layers to form a monolithic ceramic body;
• forming a void in the monolithic ceramic body, the void being partially enclosed by the monolithic ceramic body, and bounded by at least a portion of a first and a second dielectric layer and portions of a first conductive layer and a second conductive layer,
• wherein the steps of sintering and forming a void further comprises providing a fugitive material in at least one of the plurality of layers of dielectric material and burning away the fugitive material during the sintering step to form the void.

A method of making a monolithic ceramic capacitor containing at least one air gap capacitance, the method comprising:

• providing a plurality of layers of a dielectric ceramic;
• providing a plurality of conductive layers;
• stacking the conductive and dielectric layers in an interleaving fashion;
• sintering the interleaved layers to form a monolithic ceramic body;
• forming a void in the monolithic ceramic body, the void being partially enclosed by the monolithic ceramic body, and bounded by at least a portion of a first and a second dielectric layer and portions of a first conductive layer and a second conductive layer,
• wherein the step of forming a void further comprises drilling an opening into at least one of the plurality of layers of a dielectric ceramic, at least one of the plurality of conductive layers, or combinations thereof.

A method of making a monolithic ceramic capacitor containing at least one air gap capacitance, the method comprising:

• providing a plurality of layers of a dielectric ceramic;
• providing a plurality of conductive layers;
• stacking the conductive and dielectric layers in an interleaving fashion;
• sintering the interleaved layers to form a monolithic ceramic body;
• forming a void in the monolithic ceramic body, the void being partially enclosed by the monolithic ceramic body, and bounded by at least a portion of a first and a second dielectric layer and portions of a first conductive layer and a second conductive layer,
• wherein the step of forming a void further comprises punching an opening into at least one of the plurality of layers of a dielectric ceramic, at least one of the plurality of conductive layers, or combinations thereof.

A method of making a monolithic ceramic capacitor containing at least one air gap capacitance, the method comprising:

• providing a plurality of layers of a dielectric ceramic;
• providing a plurality of conductive layers;
• stacking the conductive and dielectric layers in an interleaving fashion;
• sintering the interleaved layers to form a monolithic ceramic body;
• forming a void in the monolithic ceramic body, the void being partially enclosed by the monolithic ceramic body, and bounded by at least a portion of a first and a second dielectric layer and portions of a first conductive layer and a second conductive layer,
• wherein the step of forming a void further comprises laser cutting an opening into at least one of the plurality of layers of a dielectric ceramic, at least one of the plurality of conductive layers, or combinations thereof.