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US 11,443,892 B2Granted
Substrate assembly with encapsulated magnetic feature
AssigneeIntel Corporation
InventorsKyu-Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji Yong Park, Junnan Zhao, Seo Young Kim
Life of this patent
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Abstract
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
Claims17
A substrate assembly, comprising:
- a base substrate;
- a magnetic feature encapsulated within the base substrate, the magnetic feature having a top surface opposite a bottom surface, and side surfaces between the top surface and the bottom surface;
- and
- a coil, wherein a portion of the coil extends through one or more of the side surfaces of the magnetic feature.
1 more element
A computer device, comprising:
- a printed circuit board (PCB);
- a substrate assembly coupled to the PCB, wherein the substrate assembly includes:
- a base substrate;
- a magnetic feature encapsulated within the base substrate, the magnetic feature having a top surface opposite a bottom surface, and side surfaces between the top surface and the bottom surface;
- and
- a coil, wherein a portion of the coil extends through one or more of the side surfaces of the magnetic feature;
- and
- a semiconductor chip coupled to the substrate assembly, wherein a portion of the semiconductor chip is electrically coupled to the coil.
5 more elements
A substrate assembly, comprising:
- a base substrate, wherein the base substrate includes a first conductive path located toward a first side of the base substrate and a second conductive path located toward a second side of the base substrate, the first side of the base substrate being opposite to the second side of the base substrate;
- a magnetic feature encapsulated within the base substrate, wherein the magnetic feature is located between the first conductive path and the second conductive path;
- and
- a coil, wherein a portion of the coil extends through the magnetic feature.
1 more element
Dependencies are inferred from the claim text.