Thin film barrier seed metallization in magnetic-plugged through hole inductor

An inductor, comprising;

• a substrate core;
• a conductive through-hole through the substrate core;
• and
• a magnetic sheath around the conductive through-hole, wherein the magnetic sheath is separated from the conductive through-hole by a barrier layer that is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath, wherein the first surface of the magnetic sheath is not substantially coplanar with a first surface of the substrate core and wherein the second surface of the magnetic sheath is not substantially coplanar with a second surface of the substrate core, wherein a first film layer is formed over the first surface and a second film layer is formed over the second surface of the substrate core, and wherein the first and second film layers are in direct contact with the magnetic sheath.