Conductive film and manufacturing method thereof

A conductive film, comprising:

• a carrier layer comprising a first side surface and a second side surface that are opposite to each other, wherein the first side surface of the carrier layer is recessed to form a first groove and a second groove that are not in communication with each other;
• a conductive section formed by a conductive material filled in the first groove;
• a lead formed by a conductive material filled in the second groove;
• and
• a bridging portion arranged on the first side surface and configured to electrically connect the conductive section with the lead,
• wherein the bridging portion itself is located in a same film layer, and
• wherein the bridging portion is in electrical contact with the lead, and the bridging portion and the lead are located in different film layers,
• wherein the conductive section comprises first grids connected to each other, the lead comprises second grids connected to each other, and the bridging portion electrically connects the first grids with the second grids,
• wherein the conductive film comprises a plurality of conductive sections extending vertically and a plurality of conductive sections extending horizontally, the conductive section being one of the plurality of vertically extending sections or one of the plurality of horizontally extending sections;
• and
• wherein each the plurality of conductive sections extending horizontally is disconnected at positions where the conductive section extending horizontally intersects the plurality of conductive sections extending vertically, and disconnected portions of each of the plurality of conductive sections extending horizontally are electrically connected to each other via a second bridging portion.