Wiring structure, fuser device, and image forming apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsShanying Pan, Takayuki Masunaga
Life of this patent
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AssigneeKabushiki Kaisha Toshiba
InventorsShanying Pan, Takayuki Masunaga
Estimating the term…
According to one embodiment, a wiring structure includes a substrate, a first conductor, second conductors, a first trace, second traces, heat-generating elements, and a first protruding conductor. The second conductors are spaced apart from the first conductor in a second direction crossing a first direction and are mutually juxtaposed with spacing in the first direction. The heat-generating elements are mutually juxtaposed in the first direction and connected to the respective second conductors and the first conductor. The first protruding conductor protrudes from either of the first conductor and one of the second conductors and is connected to a first one of the heat-generating elements. The first protruding conductor is at least partly located, in the first direction, between a center of the first one of the heat-Generating elements and a center of a second one of the heat-generating elements adjacent to the first one.
A wiring structure comprising:
Dependencies are inferred from the claim text.