Micromechanical pressure sensor device and corresponding manufacturing method

A method for manufacturing a micromechanical pressure sensor device, comprising the following steps:

• providing a sensor substrate having a front side and a rear side;
• forming a pressure sensor unit suspended in the sensor substrate;
• forming a first cavity above the pressure sensor unit, which is exposed via one or multiple access openings to the front side;
• forming one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity;
• bonding a circuit substrate including a strip conductor unit on the rear side of the sensor substrate, the strip conductor unit including a plurality of strip conductor levels and interposed insulation layers;
• forming a second cavity below the pressure sensor unit in the circuit substrate in the strip conductor unit, the second cavity being in fluidic connection with the stress relief trenches;
• forming at least one channel, in a periphery of the pressure sensor unit, which extends from the front side to the rear side and which is in fluidic connection with the second cavity.