Power circuit module

A power circuit module comprising:

• an electronic circuit board on which an electronic component is mounted;
• at least one heat generating element mounted on a first surface of the electronic circuit board, the heat generating element generating heat in connection with conversion or control of power and being a semiconductor electronic component that constitutes a part of a power circuit;
• a temperature detecting element mounted on the electronic circuit board, the temperature detecting element detecting temperature of the heat generating element;
• an electric circuit wiring formed on the electronic circuit board;
• a heat dissipating body that dissipates heat of the heat generating element, size of the heat dissipating body being set depending on a desired heat dissipation effect;
• and
• a heat conduction sheet having elasticity and flexibility, the heat conduction sheet having a thickness,
• wherein
• the heat conduction sheet is between the heat generating element and the heat dissipating body,
• the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and
• with regard to sizes of heat capacities of the temperature detecting element, the heat generating element, and the heat dissipating body, a following relationship holds:
• temperature detecting element<heat generating element<heat dissipating body,
• the electronic circuit board is formed by single hot press lamination of a plurality of resin substrates including a resin substrate on which a copper foil pattern is formed, and is a flexible resin multilayer board in which the electric circuit wiring is formed on the electronic circuit board, and
• the resin substrate has a smaller relative permittivity, a smaller dielectric dissipation factor, and a smaller water absorption coefficient, compared with a resin material for a glass epoxy board.

A power circuit module comprising:

• an electronic circuit board on which an electronic component is mounted;
• at least one heat generating element mounted on a first surface of the electronic circuit board, the heat generating element generating heat in connection with conversion or control of power and being a semiconductor electronic component that constitutes a part of a power circuit;
• a temperature detecting element mounted on the electronic circuit board, the temperature detecting element detecting temperature of the heat generating element;
• an electric circuit wiring formed on the electronic circuit board;
• a heat dissipating body that dissipates heat of the heat generating element, size of the heat dissipating body being set depending on a desired heat dissipation effect;
• and
• a heat conduction sheet having elasticity and flexibility, the heat conduction sheet having a thickness,
• wherein
• the heat conduction sheet is between the heat generating element and the heat dissipating body,
• the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and
• with regard to sizes of heat capacities of the temperature detecting element, the heat generating element, and the heat dissipating body, a following relationship holds:
• temperature detecting element<heat generating element<heat dissipating body,
• with regard to sizes of the thermal resistances among the temperature detecting element, the heat generating element, and the heat dissipating body,
• when a thermal resistance between the heat generating element and the temperature detecting element is expressed as (heat generating element−temperature detecting element), a thermal resistance between the heat generating element and the heat dissipating body is expressed as (heat generating element−heat dissipating body), and a thermal resistance between the temperature detecting element and the heat dissipating body is expressed as (temperature detecting element−heat dissipating body), a following relationship holds:
• (heat generating element−temperature detecting element)<(heat generating element−heat dissipating body)<(temperature detecting element−heat dissipating body).

A power circuit module comprising:

• an electronic circuit board on which an electronic component is mounted;
• at least one heat generating element mounted on a first surface of the electronic circuit board, the heat generating element generating heat in connection with conversion or control of power and being a semiconductor electronic component that constitutes a part of a power circuit;
• a temperature detecting element mounted on the electronic circuit board, the temperature detecting element detecting temperature of the heat generating element;
• an electric circuit wiring formed on the electronic circuit board;
• a heat dissipating body that dissipates heat of the heat generating element, size of the heat dissipating body being set depending on a desired heat dissipation effect;
• a heat conduction sheet having elasticity and flexibility, the heat conduction sheet having a thickness;
• a second surface side heat conduction sheet in contact with a second surface of the electronic circuit board, the second surface being an opposite surface of the first surface;
• and
• a second surface side heat dissipating body in contact with the second surface side heat conduction sheet,
• wherein
• the heat conduction sheet is between the heat generating element and the heat dissipating body,
• the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and
• with regard to sizes of heat capacities of the temperature detecting element, the heat generating element, and the heat dissipating body, a following relationship holds:
• temperature detecting element<heat generating element<heat dissipating body.

A power circuit module comprising:

• an electronic circuit board on which an electronic component is mounted;
• a plurality of heat generating elements mounted on a first surface of the electronic circuit board, the plurality of heat generating elements generating heat in connection with conversion or control of power and each being a semiconductor electronic component that constitutes a part of a power circuit;
• a temperature detecting element mounted on the electronic circuit board, the temperature detecting element detecting temperature of the plurality of heat generating elements;
• an electric circuit wiring formed on the electronic circuit board;
• a heat dissipating body that dissipates heat of the plurality of heat generating elements, size of the heat dissipating body being set depending on a desired heat dissipation effect;
• and
• a heat conduction sheet having elasticity and flexibility, the heat conduction sheet having a thickness,
• wherein
• the heat conduction sheet is between the plurality of heat generating elements and the heat dissipating body,
• the temperature detecting element is thermally connected to the plurality of heat generating elements via the heat conduction sheet and is electrically connected via the electric circuit wiring, and
• with regard to sizes of heat capacities of the temperature detecting element, the plurality of heat generating elements, and the heat dissipating body, a following relationship holds:
• temperature detecting element<heat generating elements<heat dissipating body,
• the heat conduction sheet is thermally coupled to the plurality of heat generating elements, and
• the temperature detecting element is near a high temperature heat generating element so as to have a largest thermal coupling between the temperature detecting element and the high temperature heat generating element and detects a temperature of the high temperature heat generating element, the high temperature heat generating element being one of the plurality of heat generating elements and having a highest generated-heat temperature.