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US 11,441,636 B2Granted
Bearing assembly
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorsChi-Cheng Hsiao, Ying-Chao Peng, Chun-Ying Yang
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AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorsChi-Cheng Hsiao, Ying-Chao Peng, Chun-Ying Yang
Estimating the term…
A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.
A bearing assembly, configured to be disposed on a casing of an electronic device, the bearing assembly comprising:
Dependencies are inferred from the claim text.