Composition for forming adhesive film for imprinting, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

A composition for forming an adhesive film for imprinting, the composition comprising:

• a resin (A) having a polymerizable group, said resin (A) having at least one kind of a repeating unit derived from a polymerizable compound having a ClogP value less than or equal to 0;
• at least one of a resin (B) which has a polymerizable group and does not have a repeating unit derived from a polymerizable compound having a ClogP value less than or equal to 0, and a resin (C) which does not have a polymerizable group and has a repeating unit derived from a polymerizable compound having a ClogP value less than or equal to 0;
• and
• a solvent,
• wherein solubility of the resin (A) in water at 25° C. is greater than or equal to 1 mass %, provided that the ClogP value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol,
• the polymerizable compound has an -alkylene group-oxygen atom-structure, in which the alkylene group has 1 to 6 carbon atoms, and
• the number of repeating units of the -alkylene group-oxygen atom-structure is 2 to 90.