Solder mask inkjet inks for manufacturing printed circuit boards

A method of manufacturing an electronic device comprising:

• jetting a radiation curable inkjet ink onto a dielectric substrate including an electrically conductive pattern;
• and
• curing the radiation curable inkjet ink jetted onto the dielectric substrate;
• wherein
• the radiation curable inkjet ink includes a cationic polymerizable compound and a photoinitiating system including a thioxanthone and a sulphonium compound having a chemical structure according to Formula I:
• wherein
• Y is selected from the group consisting of S, O, —CH2—, CO, and NR4;
• R4 is selected from the group consisting of H, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aryl group;
• R1, R2, and R3 are independently selected from the group consisting of H, a substituted or unsubstituted C1-C6 linear or branched alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted O-alkyl group, a hydroxyl group, a halogen, a substituted or unsubstituted S-alkyl group, a substituted or unsubstituted S-aryl group, and a NR5R6 group;
• R5 and R6 are independently selected from the group consisting of H, a substituted or unsubstituted linear or branched alkyl group, a substituted or unsubstituted cycloalkyl group, and a substituted or unsubstituted aryl group;
• X is a group according to formula MQp;
• M is B, P, As, or Sb;
• Q is F, Cl, Br, I, or a perfluorophenyl;
• and
• p is an integer from 4 to 6.