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US 11,440,990 B2Granted
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
AssigneeShowa Denko Materials Co., Ltd.
InventorsYuka Yoshida, Naoki Maruyama, Tomoko Higashiuchi, Kazumasa Fukuda, Keiichiro Nishimura, Yoshitaka Takezawa
Life of this patent
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Abstract
An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.
Claims13
An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group, wherein the at least two mesogenic structures are mesogenic structures represented by the following Formula (3):
- wherein, in Formula (3), each of R3 to R6 independently represents a hydrogen atom.
Dependencies are inferred from the claim text.