Method for producing a substrate adapter and substrate adapter for connecting to an electronic component

A method for producing a substrate adapter for connecting to an electronic component, comprising:

• arranging at least one contacting material layer on a surface of a substrate and between at least one side of a carrier and the surface of the substrate such that the at least one contacting material layer has at least one predetermined breaking point;
• joining the carrier and the substrate to the at least one contacting material layer;
• wherein the carrier comprises at least one adhesive layer with a substantially constant adhesive force over the surface of the carrier;
• and
• wherein the at least one contacting material layer comprises at least one of a sinter material, a sinter paste, and a sinter foil;
• wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer with a plurality of material recesses in the at least one contacting material layer thereby forming the at least one predetermined breaking point, wherein the plurality of material recesses are situated on a surface of the at least one contacting material layer or face toward the carrier;
• and
• lifting off and detaching the substrate with the contacting material layer arranged thereon, the contacting material layer breaks off along the predetermined breaking point.