Method and system for mass assembly of thin-film materials
AssigneePalo Alto Research Center Incorporated
InventorsJengPing Lu, Eugene M. Chow, Sourobh Raychaudhuri
Life of this patent
Estimating the term…
Abstract
Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.
Claims15
A system comprising:
- a plurality of chiplet carriers each comprising a portion of thin film material attached to a portion of a carrier wafer, a sheet of the thin film material being attached to the carrier wafer before the carrier wafer and the thin film material are separated into the chiplets;
- a micro assembler that arranges the chiplet carriers on an assembly surface from a disordered pattern to a predetermined pattern;
- and
- a carrier that transfers the portions of the thin film material from the chiplet carriers to a target substrate.
A system comprising:
- means for attaching sheets of thin film material to a carrier wafer;
- means for separating the carrier wafer and the attached sheets of the thin film material to form chiplet carriers, each chiplet carrier comprising a portion of the thin film material attached to a portion of the carrier wafer;
- means for placing the chiplet carriers on an assembly surface in a disordered pattern;
- means for arranging the chiplet carriers from the disordered pattern to a predetermined pattern;
- means for transferring the portions of the thin film material from the chiplet carriers to a target substrate;
- and
- means for mapping the sheets of the thin film material in relation to the portions of the carrier wafer before separating the carrier wafer to form the chiplet carriers, the mapping used to select the chiplet carriers to be arranged in the predetermined pattern.
Dependencies are inferred from the claim text.