Additive manufacturing object conductivity
AssigneeHewlett-Packard Development Company, L.P.
InventorsGreg Scott Long, Phil D Matlock, Jake Wright, David L Erickson
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Development Company, L.P.
InventorsGreg Scott Long, Phil D Matlock, Jake Wright, David L Erickson
Estimating the term…
Some examples include an additive manufacturing method for controlling electrostatic discharge of a build object. The method includes receiving data related to a build object, the data including conductivity data, selectively depositing a first portion of a printing agent onto a build material layer in a pattern of an object layer of a build object, the printing agent being electrically conductive at a predetermined dosage, the first portion deposited at less than the predetermined dosage, selectively depositing a second portion of the printing agent onto the build material layer at an area of the pattern, the printing agent at the area deposited at or above the predetermined dosage, and applying fusing energy to form the object layer, the object layer of the build object including a shell formed at the area and a core, the shell being electrically conductive and the core being electrically non-conductive.
An additive manufacturing method for controlling electrostatic discharge of a build object, the method comprising:
An additive manufacturing method for controlling electrostatic discharge of a build object, the method comprising:
An additive manufactured build object comprising:
Dependencies are inferred from the claim text.