Coated compressive subpad for chemical mechanical polishing
AssigneeCMC Materials, Inc.
InventorsDiane Scott, Paul Andre Lefevre
Life of this patent
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Abstract
Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.
Claims10
A subpad for a polishing pad stack, the subpad comprising:
- a compressive subpad material having a first surface and a second, opposite, surface;
- a first pressure sensitive adhesive layer coated on the first surface of the compressive subpad material, and a first release liner disposed on the first pressure sensitive adhesive layer;
- and
- a second pressure sensitive adhesive layer coated on the second surface of the compressive subpad material, wherein the compressive subpad material is a compressive foam subpad material, and wherein the first and second surfaces of the compressive foam subpad material each have a surface energy approximately in the range of 30-40 dyne/cm2, and the first pressure sensitive adhesive layer is in direct contact with at least 90% of the total surface area of the first surface of the compressive subpad material.
Dependencies are inferred from the claim text.