Multiple module chip manufacturing arrangement

A unitary wafer assembly arrangement for the application of solder balls onto a wafer substrate for subsequent use in the electronics industry, the wafer assembly arrangement comprising:

• an arrangement of wafer treatment modules interconnected to and serviced by a central wafer handling robot to provide a unitary system, the modules including a pre-aligner loadport module for receipt of wafers to be treated, a binder module of the application of a fluid binder onto an upper surface of the wafer, a solder ball mount module for the application of a plurality of solder balls onto the wafer, an inspection module including a review analysis, and insertion and extraction arrangement of misap-plied solder balls deposited on the wafer, and a reflow module for the heating and securing the solder balls onto an arrangement of pads on the wafer;
• collectively identified herewith, wherein the loadport module is arranged for receipt of untreated wafers, the binder module is arranged for holding each wafer by support pin vacuum arrangement during a binder spray deposition and binder cleanup operation;
• and wherein a pre-alignment operation of the wafer in a loadport and transference operation to a vacuum cup pin support arrangement in the solder wall mount module for optical alignment review by a plurality of cameras, including a solder balls distributing stencil, and including a solder ball distribution reservoir over the stencil for controlled release of solder balls onto a wafer there below, and including improper solder ball and excess binder retrieval means, and a three station reflow module for the heat treatment of the loaded wafer, or final transfer to the loadport for finished wafer collection.