Method for producing an aperture plate

A method of manufacturing an aperture plate wafer, the method comprising:

• applying a mask over a substrate in a pattern of columns, each column having a frustoconical bottom portion terminating in a convex top surface, wherein a height of each column is greater than a diameter of each column;
• electroplating a plating material around the columns at a first speed to form a first thickness;
• over-plating the plating material directly on the top surfaces of the pattern of columns at a second speed less than the first speed to form a second thickness and so as to form a plurality of aerosol-forming apertures, wherein the first thickness is greater than the second thickness;
• removing the plated material from the mask and the substrate to provide a wafer of electroplated material with the plurality of aerosol-forming apertures and tapered entrainment portions;
• and
• forming the aperture plate wafer into a dome-shape.

A method of manufacturing an aperture plate wafer, the method comprising:

• applying a mask over a substrate in a pattern of columns, each column tapering to define a frustoconical bottom portion with a convex top surface, wherein a height of each column is greater than a diameter of each column;
• electroplating a plating material around the columns at a first speed to form a first thickness;
• over-plating the plating material directly on the top surfaces of the pattern of columns at a second speed less than the first speed to form a second thickness and so as to form a plurality of aerosol-forming apertures, wherein the first thickness is greater than the second thickness;
• and
• removing the plated material from the mask and the substrate to provide a wafer of electroplated material with the plurality of aerosol-forming apertures aligned with tapered entrainment portions;
• wherein, the wafer includes only one layer of electroplated material and wherein a combined thickness of the first thickness and the second thickness is in the range of 50 μm to 70 μm.