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US 11,432,715 B2Granted
System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects
AssigneeDePuy Synthes Products, Inc.
InventorLaurent Blanquart
Life of this patent
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Abstract
Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.
Claims17
An imaging sensor comprising:
- a pixel array comprising a plurality of pixel columns disposed on a first substrate, wherein each of the plurality of pixel columns is divided into a plurality of pixel sub-columns;
- a plurality of supporting circuits disposed on one or more additional substrates, the plurality of supporting circuits comprising a plurality of circuit columns, wherein each of the plurality of circuit columns is divided into a plurality of circuit sub-columns;
- and
- a plurality of interconnects for electrically connecting each pixel sub-column to one of the plurality of circuit sub-columns;
- wherein each of the plurality of circuit sub-columns has an area, a size, and an aspect ratio, and each of the plurality of pixel sub-columns that corresponds to each one of the circuit sub-columns has an area, a size, and an aspect ratio;
- and
- wherein the aspect ratio of at least one of the circuit sub-columns has a width equal to “N” times the width of the aspect ratio of one of said pixel sub-columns and a length equal to 1/“N” times the length of the aspect ratio of one of said pixel sub-columns.
4 more elements
Dependencies are inferred from the claim text.