Component mounting method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorHideki Sumi
Life of this patent
Estimating the term…
Abstract
A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.
Claims6
A component mounting method in a component mounting apparatus including
- a first board transport lane configured to carry a first board,
- a first mounting head,
- a second board transport lane which is disposed along the first board transport lane configured to carry a second board,
- a second mounting head,
- a first component supplier being disposed closer to the first board transport lane than to the second board transport lane, and
- a second component supplier being disposed closer to the second board transport lane than to the first board transport lane,
- the method comprising:
- cross lane alternate mounting of alternately performing an operation of sucking a component from the second component supplier by the second mounting head, and mounting the component on the first board carried by the first board transport lane, and
- an operation of sucking a component from the first component supplier by the first mounting head, and mounting the component on the second board carried by the second board transport lane;
- and
- a normally alternate mounting of alternately performing
- an operation of sucking a component from the first component supplier by the first mounting head, and mounting the component on any one of the first board and the second board, and
- an operation of sucking a component from the second component supplier by the second mounting head, and mounting the component on the one of the first board and the second board.
Dependencies are inferred from the claim text.