Method for increasing EAM bandwidth, component structure and manufacturing process thereof using plural p-i-n waveguides serially connected by high-impedance transmission lines

A component structure for increasing the bandwidth of an electroabsorption modulator, comprising:

• a p-i-n optical waveguide, formed on the electroabsorption modulator, the p-i-n optical waveguide having a plurality of the p-i-n active waveguides of the electroabsorption modulator;
• high-impedance transmission lines, used in series to connect the p-i-n active waveguides of the electroabsorption modulator to reduce microwave reflection and increase the bandwidth of the electroabsorption modulator;
• and
• an input impedance-controlled transmission line and an output impedance-controlled transmission line, formed respectively at two ends of the electroabsorption modulator.

A manufacturing process of an electroabsorption modulator for increasing the bandwidth of the electroabsorption modulator, comprising the steps of:

• providing a semiconductor substrate, and forming a p-i-n optical waveguide on the semiconductor substrate;
• forming a plurality of p-i-n active waveguides for the electroabsorption modulator on the p-i-n optical waveguide;
• forming high-impedance transmission lines on the semiconductor substrate in series to connect the p-i-n active waveguides of the electroabsorption modulator;
• and
• forming an input impedance-controlled transmission line and an output impedance-controlled transmission line, respectively at two ends of the electroabsorption modulator.