Thermal modules for electronic devices
AssigneeHewlett-Packard Development Company, L.P.
InventorsShaheen Saroor, Lan-Chin Chiou, Hung-Ming Lin
Life of this patent
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Abstract
Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.
Claims16
A thermal module for use with an electronic device comprising:
- a first heatsink defining a first airflow, the first airflow having a first airflow exit and a second airflow exit, the first airflow exit non-parallel relative to the second airflow exit, the first heatsink including a first set of fins having a first height and a second set of fins having a second height, the second height less than the first height, the second set of fins adjacent the second airflow exit;
- and
- a second heatsink defining a second airflow, the second airflow having a third airflow exit, the second heatsink spaced from the first heatsink to form a gap therebetween, the second heatsink thermally coupled to the first heatsink via a heat pipe.
A thermal module for an electronic device comprising:
- a first heatsink;
- a second heatsink adjacent the first heat sink;
- a first heat pipe thermally coupling the first heatsink and the second heatsink, the first heat pipe to transfer heat between the first and second heatsinks;
- a first fan to generate a first airflow across the first heatsink, the first airflow to flow through a first outlet and a second outlet, the first outlet being non-parallel relative to the second outlet;
- and
- a second fan to generate a second airflow across the second heatsink, the second airflow to flow through a third outlet, the third outlet being non-perpendicular relative to the second outlet.
An electronic device comprising:
- a chassis defining a cavity;
- a circuit board in the cavity;
- a first heatsink adjacent the circuit board, the first heatsink including first fins extending between a first end of the first heatsink defining a first inlet and a second end of the first heatsink opposite the first end defining a first outlet, a first portion of the first fins having a reduced height adjacent the second end, a second portion of the first fins defining a second outlet, the second outlet being non-parallel relative to the first outlet;
- a first fan to provide a first airflow across the first heatsink, the first airflow to flow through the first outlet and the second outlet;
- and
- a first duct between the first fan and the first heatsink to channel the first airflow toward the first heatsink.
Dependencies are inferred from the claim text.