Circuit board, method for manufacturing the same, and backlight

A circuit board, comprising:

• an insulating base layer;
• a first conductive circuit layer disposed on a surface of the base layer;
• a solder mask layer covering a surface of the first conductive circuit layer away from the base layer, wherein the solder mask layer defines a slot, the slot is configured to expose a portion of the first conductive circuit layer, the exposed portion of the first conductive circuit layer forms a solder pad, the solder mask layer comprises a sidewall at the slot;
• and
• a cover film covering a surface of the solder mask layer away from the first conductive circuit layer, wherein the cover film comprises a first light diffusing material, the cover film defines an opening, the opening corresponds to the slot and is configured to expose the solder pad, the cover film comprises a covering portion and a side reflecting portion, the covering portion is disposed on the solder mask layer having the slot, the side reflecting portion is connected to the covering portion and covers the sidewall.

A backlight, comprising:

• a light emitting element;
• and
• a circuit board, comprising:
• an insulating base layer;
• a first conductive circuit layer disposed on a surface of the base layer;
• a solder mask layer covering a surface of the first conductive circuit layer away from the base layer, wherein the solder mask layer defines a slot, the slot is configured to expose a portion of the first conductive circuit layer, the exposed portion of the first conductive circuit layer forms a solder pad, the solder mask layer comprises a sidewall at the slot;
• and
• a cover film covering a surface of the solder mask layer away from the first conductive circuit layer, wherein the cover film comprises a first light diffusing material, the cover film defines an opening, the opening corresponds to the slot and is configured to expose the solder pad, the cover film comprises a covering portion and a side reflecting portion, the covering portion is disposed on the solder mask layer having the slot, the side reflecting portion is connected to the covering portion and covers the sidewall, and the light emitting element is electrically connected to the solder pad.