Thermoforming an electronic device with surface curvature

A method of manufacturing a curved electronic device the method comprising:

• providing a substrate comprising a thermoplastic material;
• printing a patterned layer of non-conductive support material to form a support pattern onto the substrate, wherein the support pattern comprises support islands interconnected by support lines bridging open areas of the substrate without the support material between the support islands;
• applying an electrical circuit onto the support pattern, wherein the electrical circuit comprises circuit lines comprising a conductive material applied onto the support lines, and electrical components applied onto the support islands, the electrical components being electrically interconnected by the circuit lines;
• and
• deforming, using a thermoforming process with an elevated processing temperature, a shape of the substrate with the support pattern and electrical circuit according to a predefined surface curvature,
• wherein the support material has a higher resistance to the deforming than the thermoplastic material of the substrate at the processing temperature, and
• wherein the deforming is concentrated to the open areas between the support islands while the higher resistance of the support material to the deforming maintains a structural integrity of the electrical circuit applied thereon during the thermoforming process.