Semiconductor component, and contacting assembly having a semiconductor component and a printed circuit board

A contact-making arrangement (1) comprising

• a semiconductor component (2), which comprises a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of flat connection points (12), wherein the connection points (12) are arranged on a bottom side of the housing (5), and
• a printed circuit board (7), which comprises a contact arrangement (20) having at least two rows (24, 26) of contacts (22), wherein a geometry of the contact arrangement (20) corresponds to a geometry of the connection point arrangement (10) and the connection points (12) of the connection point arrangement (10) are electrically connected via connections (9) to corresponding contacts (22) of the contact arrangement (20),
• wherein the connection points (12) of the connection point arrangement (10) are separated by way of the contacts (22) of the contact arrangement (20) and by way of conductor tracks (28) of the printed circuit board (7), wherein a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and between two adjacent first contacts (24A) of a first row (24) of the contact arrangement (20), and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10) and between two adjacent second contacts (26A) of a second row (26) of the contact arrangement (20), wherein the second connection points (16A) and the second contacts (26A) of the respective second row (16, 26) are arranged offset to the first connection points (14A) and the first contacts (24A) of the respective first row (14, 24), wherein the second contacts (26A) of the second row (26) are configured to be contacted via the conductor tracks (28), which are each led through an intermediate space (B, C, D) between two adjacent contacts (24A) of the first row (24), and wherein the first distance at least between two adjacent first connection points (14A) of the first row (14) of the connection point arrangement (10) and between two corresponding adjacent first contacts (24A) of the first row (24) of the contact arrangement (20) corresponds to an intermediate space (C, D) between two contacts (22) of the contact arrangement (20), in which intermediate space at least two conductor tracks (28) having functionally reliable dimensions and distances can be arranged, said at least two conductor tracks each making contact with a second contact (26A) of the second row (26).