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US 11,310,907 B2Granted
Microelectronic package with substrate-integrated components
AssigneeIntel Corporation
InventorsGeorgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
Life of this patent
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Abstract
Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.
Claims13
A microelectronic package, comprising:
- a package substrate;
- a die coupled with a face of the package substrate;
- overmold material at least partially surrounding the die, wherein the overmold material comprises a conductive through-mold via (TMV) proximate to the die;
- a first inductor and a second inductor positioned in the package substrate and within a die shadow of the die;
- and
- electromagnetic interference (EMI) shield elements positioned within the package substrate and surrounding the first inductor and the second inductor, wherein:
- the package substrate comprises a first redistribution layer having a first thickness and a second redistribution layer having a second thickness, the second thickness being less than the first thickness,
- the first inductor is in the first redistribution layer,
- the second inductor is in the second redistribution layer, and
- the second inductor has a lower Q-factor than the first inductor.
7 more elements
An electrical device, comprising:
- a processing device;
- and
- a communication chip,
- wherein at least one of the processing device and the communication chip includes a microelectronic package that includes:
- a package substrate comprising a first redistribution layer and a second redistribution layer, the second redistribution layer being thinner than the first redistribution layer,
- a die coupled with a face of the package substrate,
- overmold material at least partially surrounding the die, and comprising a conductive TMV proximate to the die,
- a first inductor and a second inductor positioned in the first redistribution layer and the second redistribution layer respectively of the package substrate and within a die shadow of the die, and
- electromagnetic interference (EMI) shield elements positioned within the package substrate and surrounding the inductor.
6 more elements
Dependencies are inferred from the claim text.