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US 11,310,905 B2Granted
Memory device including a conductive plate with a shielding region
AssigneeSamsung Electronics Co., Ltd.
InventorsChung Hyun Ryu, In Sub Kwak, Min Woo Gu
Life of this patent
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Abstract
Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
Claims17
A memory device, comprising:
- a module board on which one or more semiconductor devices are disposed;
- a conductive plate mounted on a first side of the module board, wherein the conductive plate includes a shielding region and a non-shielding region;
- and
- a pad disposed in the shielding region of the conductive plate, the pad is configured for electrostatic discharge shielding,
- wherein the one or more semiconductor devices include a memory controller, and
- wherein the memory controller is disposed on the first side of the module board in the shielding region,
- wherein a first side of the pad is in direct contact with the memory controller and second side of the pad is in direct contact with the conductive plate.
4 more elements
A memory device, comprising:
- a module board on which a memory controller is disposed;
- and
- a conductive back plate mounted on a first side of the module board,
- wherein the conductive back plate includes a shielding region and a non-shielding region, the shielding region including a first material configured for electrostatic discharge shielding, and
- wherein the memory controller is disposed in the shielding region and overlaps the first material,
- wherein a first side of the first material is in direct contact with the memory controller and a second side of the first material is in direct contact with the conductive back plate.
3 more elements
A memory device, comprising:
- a module board on which one or more semiconductor devices are disposed;
- and
- a conductive plate mounted on a first side of the module board,
- wherein the conductive plate includes a shielding wall structure formed on the conductive plate,
- wherein a first material configured for electrostatic discharge shielding is disposed inside the shielding wall structure,
- wherein the one or more semiconductor devices include a memory controller, and
- the memory controller is disposed on the first side of the module board and is inside the shielding wall structure,
- wherein a pad including the first material is disposed inside the shielding wall structure, and
- wherein a first side of the pad is in direct contact with the memory controller, and a second side of the pad is in direct contact with the conductive plate.
6 more elements
Dependencies are inferred from the claim text.