US 11,309,932 B1 · Receiver-transmitter impedance co-matching method using bondwires

Abstract

Semiconductor chips are made increasingly smaller, thanks to improved design techniques and process scaling. Sometimes the bottleneck is not the chip itself but the package size due to many necessary pins. To help reduce the number of package pins, the chip should use less pins by sharing or reusing pins if possible. Therefore, single-ended RF input/output is used for transceiver, and the same pin is shared between RX and TX. A receiver (RX)-transmitter (TX) impedance co-matching method uses multiple bondwires for transceivers sharing one input/output (I/O) pin between RX and TX. The RX input impedance and TX output impedance are transformed closer to each other or even to the same impedance, which makes it possible to get the best RX and TX performance with just one matching network. The chip area is also saved without using on-chip inductors.

Claims18

Dependent claims

A method for minimizing a difference between a transmitter impedance and a receiver impedance in a wireless communication transceiver, the method comprising:

interconnecting a receiver connection from a transceiver with a package pin of a chip with a receiver bondwire;
and
interconnecting a transmitter connection from the transceiver to the package pin of the chip with a plurality of transmitter bondwires, each of the transmitter bondwires disposed in parallel with each other.

Dependencies are inferred from the claim text.

Receiver-transmitter impedance co-matching method using bondwires

Life of this patent

Receiver-transmitter impedance co-matching method using bondwires

Life of this patent

Abstract

Claims18