Integrated multilayer structure and a method for manufacturing a multilayer structure

An integrated multilayer structure comprising:

• a substrate film comprising an electrically substantially insulating material;
• a circuit design comprising electrically conductive elements, provided on the substrate film, said conductive elements defining a number of contact areas;
• a connector at an outermost edge of the substrate film, the connector comprising a number of electrically conductive elongated contact elements connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector, the connector including an electrically insulating connector housing for the contact elements, the contact elements at least partially positioned in contact with the outermost edge of the substrate film;
• at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially excluding the extended portions of the contact elements configured to couple to the external connecting element;
• and a further substrate film having a further circuit design with electrically conductive elements thereon, wherein plastic material of one or more plastic layers of the at least one plastic layer is located between the substrate films, the circuit designs of the substrate films being electrically connected by the connector and/or a connecting member.

A method for manufacturing a multilayer structure, comprising:

• obtaining a substrate film having an outer surface that extends to an outermost edge, the substrate film comprising an electrically substantially insulating material for accommodating electronics;
• providing, at least in part by printed electronics technology, a circuit design comprising electrically conductive elements, including traces, of electrically conductive material on the substrate film, said conductive elements defining a number of contact areas;
• arranging at least one connector on the outer surface of the substrate film so that the at least one connector extends from the outer surface to the outermost edge of the substrate film, the connector comprising a number of electrically conductive elongated, substantially rigid, contact elements connected to the contact areas of the conductive elements of the circuit design while being further configured to extend away from the contact areas substantially along the outer surface of the substrate film over the outermost edge of and from the substrate film to free ends thereof that selectively couple to an external connecting element responsive to mating the external connecting element with the connector, the at least one connector including an electrically insulating connector housing for the contact elements;
• at least partially positioning the contact elements in contact with the outermost edge of the substrate film and the outer surface of the substrate film;
• and
• molding, utilizing injection molding, thermoplastic or thermoset material on the substrate film so as to at least partially cover the circuit design and only partially the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially omitting the extended portions of the contact elements configured to couple to the external connecting element.

A method for manufacturing a multilayer structure, comprising:

• obtaining a substrate film comprising an electrically substantially insulating material for accommodating electronics;
• providing, at least in part by printed electronics technology, a circuit design comprising electrically conductive elements, including traces, of electrically conductive material on the substrate film, said conductive elements defining a number of contact areas;
• arranging at least one connector at the outermost edge of the substrate film, the connector comprising a number of electrically conductive elongated, substantially rigid, contact elements connected to the contact areas of the conductive elements of the circuit design while being further configured to extend from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector, the at least one connector including an electrically insulating connector housing for the contact elements;
• at least partially positioning, the contact elements in contact with the outermost edge of the substrate film;
• and
• molding, utilizing injection molding, thermoplastic or thermoset material on the substrate film so as to at least partially cover the circuit design and only partially the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially omitting the extended portions of the contact elements configured to couple to the external connecting element;
• and
• a further substrate film comprising electrically substantially insulating material for accommodating electronics is obtained and provided with a further circuit design comprising electrically conductive elements, said conductive elements defining a number of contact areas on the further substrate film;
• wherein said number of contact elements of the connector comprises a first contact element and the connector additionally comprises a second contact element that is connected to a contact area of said number of contact areas on the further substrate film, the remote ends of said first and second contact elements being configured to extend from the respective substrate films and directed adjacent each other.