Wireless communication device

A wireless communication device, comprising:

• a communication module including:
• a circuit board having a carrying surface and a back surface that is opposite to the carrying surface, wherein the circuit board includes a grounding portion;
• a communication chip mounted on the carrying surface of the circuit board;
• a plurality of passive components mounted on the carrying surface of the circuit board;
• and
• an insulating sheet disposed on the communication chip and the passive components and having a thickness that is greater than or equal to 150 μm, wherein the communication chip and the passive components are arranged in a projection space defined by orthogonally projecting the insulating sheet toward the carrying surface;
• a dust and moisture resistant adhesive covering and connected to any electrically conductive portions of the communication module on the carrying surface;
• and
• a nano-metallic layer covering and connected to the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, wherein the nano-metallic layer is electrically coupled to the grounding portion,
• wherein the wireless communication device does not include any grounding metal housing that is mounted on the circuit board and that is arranged outside of the nano-metallic layer.