Dual slot common mode noise filter
AssigneeHewlett Packard Enterprise Development LP
InventorsDavid Kopp, James Stewart, Karl Bois, Elene Chobanyan
Life of this patent
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Abstract
A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.
Claims18
An apparatus comprising:
- a multiple-layer circuit board having a signaling layer plane, an exterior layer plane, and a ground layer plane;
- a pair of differential signal lines implemented as strip-lines within the signaling layer, which propagate electromagnetic interference (EMI) along the signaling layer;
- and
- a dual slot common-mode noise filter etched into the ground layer, the dual slot common-mode noise filter including a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane, wherein the first U-shaped etching pair is positioned above the pair of differential signal lines.
A circuit board comprising:
- a signaling layer including a pair of parallel strip-lines that propagate electromagnetic interference (EMI);
- a dual slot common-mode noise filter etched into the ground layer, the dual slot common-mode noise filter including a first bracket etching pair comprising a first bracket etching comprising a first edge and a second edge parallel to one another, and a third edge perpendicular to the first edge and the second edge and connecting corresponding ends of the first edge and the second edge, and a second bracket etching opposing the first bracket etching about a Y-axis perpendicular to the pair of strip-lines, wherein the first bracket etching pair is positioned above the pair of differential signal lines.
A method comprising:
- fabricating an inner signaling layer of the circuit board to include a pair of differential signal lines that convey electromagnetic interference (EMI) along the inner signaling layer;
- and
- fabricating a ground layer of a multiple-layer circuit board, including etching a dual slot common-mode noise filter into the ground layer, wherein etching the dual slot common-mode noise filter includes etching, within the ground plane, a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching, wherein the first U-shaped etching pair and the second U-shaped etching pair are positioned symmetrically about an XY-plane formed by the inner signaling layer.
Dependencies are inferred from the claim text.