Organic light emitting diode display device with barrier wall and method of manufacturing the same

A method of manufacturing an organic light emitting diode (OLED) display device, the method comprising:

• providing a substrate comprising a display area and a non-display area;
• forming an organic light emitting diode element in the display area;
• wherein forming the organic light emitting diode element comprises:
• forming an insulating layer on the substrate;
• forming a pattern of a first electrode on the insulating layer to provide a patterned first electrode;
• forming a pixel defining layer by which the patterned first electrode is divided into a pixel unit;
• forming a light emitting layer on the first electrode;
• and forming a second electrode on the light emitting layer,
• forming a barrier wall around the display area and spaced apart from the organic light emitting diode element;
• performing a plasma treatment on the substrate after the forming of the organic light emitting diode element in the display area of the substrate;
• and
• forming a thin film encapsulation layer for coating the organic light emitting diode element,
• wherein forming the thin film encapsulation layer comprises:
• forming a first inorganic layer;
• forming an organic layer inwardly of the barrier wall, and
• forming a second inorganic layer on the organic layer, the first inorganic layer and the barrier wall such that the second inorganic layer is in contact with the organic layer, the first inorganic layer and the barrier wall,
• wherein:
• the first inorganic layer has a hole through which the barrier wall penetrates the first inorganic layer,
• a first portion of the second inorganic layer adjacent to an outer side surface of the barrier wall has a greater thickness than a second portion of the second inorganic layer adjacent to an inner side surface of the barrier wall,
• a third portion of the second inorganic layer on a top surface of the barrier wall has a less thickness than the second portion of the second inorganic layer,
• the inner side surface of the barrier wall includes a first inner side surface, a second inner side surface and a third inner side surface,
• the first inner side surface among the first to third inner side surfaces is disposed closest to the substrate,
• the third inner side surface among the first to third inner side surfaces is disposed farthest from the substrate,
• the second inner side surface is disposed between the first inner side surface and the third inner side surface,
• the first inner side surface is in contact with the first inorganic layer,
• the second inner side surface is in contact with first organic layer,
• the third inner side surface is in contact with the second inorganic layer, and
• the first to third inner side surfaces have an area gradually decreasing as the first to third inner side surfaces are disposed farther from the substrate.

A method of manufacturing an organic light emitting diode (OLED) display device, the method comprising:

• providing a substrate comprising a display area and a non-display area;
• forming an organic light emitting diode element in the display area;
• wherein forming the organic light emitting diode element comprises:
• forming an insulating layer on the substrate;
• forming a pattern of a first electrode on the insulating layer to provide a patterned first electrode;
• forming a pixel defining layer by which the patterned first electrode is divided into a pixel unit;
• forming a light emitting layer on the first electrode;
• and forming a second electrode on the light emitting layer,
• forming a barrier wall around the display area;
• performing a plasma treatment on the substrate after the forming of the organic light emitting diode element in the display area of the substrate;
• and
• forming an encapsulation layer on the organic light emitting diode element.