Data storage structure for improving memory cell reliability
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHai-Dang Trinh, Chii-Ming Wu, Cheng-Yuan Tsai, Tzu-Chung Tsai, Fa-Shen Jiang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHai-Dang Trinh, Chii-Ming Wu, Cheng-Yuan Tsai, Tzu-Chung Tsai, Fa-Shen Jiang
Estimating the term…
Various embodiments of the present disclosure are directed towards a memory cell including a data storage structure. A top electrode overlies a bottom electrode. The data storage structure is disposed between the top electrode and the bottom electrode. The data storage structure includes a first data storage layer, a second data storage layer, and a third data storage layer. The second data storage layer is disposed between the first and third data storage layers. The second data storage layer has a lower bandgap than the third data storage layer. The first data storage layer has a lower bandgap than the second data storage layer.
A memory cell comprising:
A memory device comprising:
A memory device comprising:
Dependencies are inferred from the claim text.