Flip-chip light-emitting module
AssigneeAzurewave Technologies, Inc.
InventorsKung-An Lin, Chung-Che Yang, Hung-Wei Lin, Hsiang-Yun Cheng
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Abstract
A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.
Claims5
A flip-chip light-emitting module, comprising:
- a thermal dissipation substrate including two separated plates, wherein a thermal dissipation channel is formed between the two separated plates;
- two conductive adhesive layers respectively disposed on the two separated plates;
- a package assembly including a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame, the frame including a conductive path;
- and
- a light-emitting chip including a top conductive contact and a light-emitting surface at a same first side, the top conductive contact electrically connected to the conductive path through a conductor, and including two bottom conductive contacts at a second side of the light-emitting chip opposite to the first side respectively contacting the two conductive adhesive layers;
- wherein the frame includes a side wall surrounding the thermal dissipation substrate and an extension wall extending from the side wall to the top conductive contact, the conductive path includes an external connective end disposed on the side wall, and an internal connective end disposed on the extension wall and electrically connected to the top conductive contact through the conductor.
Dependencies are inferred from the claim text.