Semiconductor light emitting devices including superstrates with patterned surfaces

A semiconductor light emitting device comprising:

• a light emitting diode (LED) chip;
• and
• a chip cover mounted directly on the LED chip, the chip cover comprising:
• a patterned superstrate that comprises a plurality of optical elements;
• and
• a recipient luminophoric medium on the patterned superstrate,
• wherein the recipient luminophoric medium is between the LED chip and the patterned superstrate,
• wherein the recipient luminophoric medium comprises a phosphor material and a binder material and is configured to absorb light of a first color that is emitted by the LED chip and emit light of a second color, different from the first color, and
• wherein the plurality of optical elements extend from a side of the patterned superstrate that is facing the recipient luminophoric medium.

A semiconductor light emitting device comprising:

• a light emitting diode (LED) chip comprising a light-emitting surface;
• a recipient luminophoric medium on the LED chip, wherein the recipient luminophoric medium comprises a phosphor material and a binder material and is configured to absorb light of a first color that is emitted by the LED chip and emit light of a second color, different from the first color;
• an adhesive layer between the recipient luminophoric medium and the LED chip;
• and
• a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising:
• a first major surface that is facing the recipient luminophoric medium:
• a second major surface that is on an opposite side of the patterned superstrate from the first major surface;
• and
• a plurality of optical elements between, in a direction normal to the light-emitting surface of the LED chip, the second major surface of the patterned superstrate and the recipient luminophoric medium.