Package structure for semiconductor device, and semiconductor device

A semiconductor structure configured to accommodate a semiconductor device, the semiconductor structure comprising:

• a metal plate, having a first surface and a second surface opposite to each other and a slot penetrating through the first surface and the second surface;
• a ceramic piece, for providing an internal and external electrical connection of the semiconductor device, an interconnected metalized pattern being arranged inside the ceramic piece;
• and
• a metal heat sink, welded on a back surface of the ceramic piece and used for disposing the semiconductor device and an associated circuit, wherein:
• the ceramic piece and the metal heat sink are vertically inserted into the slot and hermetically connected with the metal plate, and wherein:
• on the metal plate, a recess is provided along an outer periphery of the slot, and the recess is used for limiting welding flux;
• or a groove is arranged on a peripheral wall, corresponding to the slot, of the ceramic piece and the metal heat sink, and the groove is used for limiting welding flux.