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US 11,309,411 B2Granted
Insulated gate bipolar transistor and method of manufacturing same
AssigneeDB HiTek Co., Ltd.
InventorYoung-Seok Kim
Life of this patent
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Abstract
The present invention relates to an insulated gate bipolar transistor (IGBT) and, more particularly, to an insulated gate bipolar transistor that has multiple mesas having different widths, configured to promote the buildup and accumulation of hole carriers, thereby facilitating relatively easy subsequent processing, while maximizing conductivity modulation.
Claims7
An insulated gate bipolar transistor, comprising:
- a collector electrode;
- a collector layer on the collector electrode, the collector layer having a first conductivity type;
- a buffer layer on the collector layer, the buffer layer having a second conductivity type;
- a drift region on the buffer layer, the drift region having the second conductivity type;
- a body region on the drift region, the body region having the first conductivity type;
- a plurality of trench gates penetrating the body region, configured to separate a first region from a second region in the body region;
- an interlayer insulating film covering a surface of the trench gates;
- emitters spaced apart from each other on a surface of the body region in the first region, the emitters having the second conductivity type
- an emitter electrode on the interlayer insulating film;
- a first body contact overlapping each of the emitters in the first region and in contact with the emitter electrode;
- and
- a second body contact on or at the surface of the body region in the second region and in contact with the emitter electrode,
- wherein the first region includes a first mesa, the second region is adjacent to the first region and includes a second mesa, and the first mesa has a width larger than that of the second mesa.
10 more elements
Dependencies are inferred from the claim text.