Imaging element, method of manufacturing imaging element, and electronic apparatus

A method of manufacturing an imaging element, the method comprising:

• forming a frame at a position of an outer peripheral portion of a light receiving sensor on a protective substrate that protects the light receiving sensor, the frame being formed with use of an inorganic material;
• forming a planarizing film that covers an entire surface of the light receiving sensor;
• forming an infrared cutoff filter layer on an inner side on a same plane as the frame;
• and
• bonding the frame and the infrared cutoff filter layer that are formed on the same plane to the light receiving sensor by an adhesive agent, wherein a thickness of the infrared cutoff filter layer and a thickness of the frame are the same.

An electronic apparatus provided with an imaging element, the imaging element comprising:

• a light receiving sensor that performs photoelectric conversion of incoming light;
• a protective substrate that protects a top surface side serving as a light-incident surface of the light receiving sensor;
• a planarizing film covering an entire surface of the light receiving sensor;
• a frame that is disposed in an outer peripheral portion between the light receiving sensor and the protective substrate, and is formed with use of an inorganic material;
• and
• an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame, wherein a thickness of the infrared cutoff filter layer and a thickness of the frame are the same.