Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same

A method of forming a structure including a stacked die assembly, the method comprising:

• providing multiple bonded units, wherein each bonded unit comprises a respective front-side semiconductor die including front-side external bonding pads and a respective backside semiconductor die including backside external bonding pads, wherein the respective backside semiconductor die is bonded to the respective front-side semiconductor die;
• forming a vertical stack of the multiple bonded units by attaching the multiple bonded units to each other such that the front-side external bonding pads of each bonded unit have physically exposed surfaces that face upward and the backside external bonding pads of each bonded unit have physically exposed surfaces that face downward;
• forming a first set of bonding wires that connect a respective pair of front-side external bonding pads;
• and
• forming a second set of bonding wires that connect a respective pair of backside external bonding pads.