Semiconductor package including processor chip and memory chip

A semiconductor package, comprising:

• a package substrate;
• a processor chip mounted on the package substrate;
• a plurality of memory chips mounted on the package substrate and to exchange data with each other;
• a signal transmission device mounted on the package substrate, the processor chip and the signal transmission device transmit a signal therebetween via the package substrate;
• a plurality of first bonding wires that connect the plurality of memory chips directly to the signal transmission device, the plurality of memory chips and the signal transmission device transmit a signal therebetween via the plurality of first bonding wires without passing via the package substrate;
• and
• a molding member that covers lateral surfaces of the processor chip, the plurality of memory chips, and the signal transmission device, wherein:
• the processor chip, the plurality of memory chips, and the signal transmission device are spaced apart from each other, and
• the signal transmission device includes:
• upper pads in an upper surface portion of the signal transmission device, the upper pads connected to the plurality of first bonding wires;
• penetrating electrodes in a main body portion of the signal transmission device, the penetrating electrodes connected to the upper pads;
• and
• lower pads in a lower surface portion of the signal transmission device, the lower pads connected to the penetrating electrodes and connected to the package substrate via bonding balls.