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US 11,309,295 B2Granted
Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWen Hung Huang, Wen Chieh Yang
Life of this patent
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Abstract
A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.
Claims12
A semiconductor device package, comprising:
- a first passive component having an effective region and an ineffective region surrounding the effective region of the first passive component, wherein the first passive component includes a first surface having a recessing portion, and wherein the recessing portion is at the ineffective region of the first passive component;
- a second passive component having an effective region and an ineffective region surrounding the effective region of the second passive component, wherein the second passive component includes a second surface facing the first surface of the first passive component, wherein the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component, and wherein the protruding portion is at the ineffective region of the second passive component;
- an interconnection layer disposed on the first passive component and the second passive component, wherein the interconnection layer is electrically connected with the effective region of the first passive component and the effective region of the second passive component;
- and
- a substrate having a cavity, wherein the first passive component and the second passive component are accommodated in the cavity;
- wherein a contour of the protruding portion and a contour of the recessing portion are substantially matched;
- wherein the first surface of the first passive component is in contact with the second surface of the second passive component;
- and
- wherein the substrate has a top surface and a bottom surface opposite to the top surface, the first passive component has a third surface opposite to the first surface of the first passive component, and the second passive component has a fourth surface opposite to the second surface of the second passive component, wherein the third surface of the first passive component is substantially coplanar with the top surface of the substrate, and wherein the fourth surface of the second passive component is substantially coplanar with the bottom surface of the substrate.
6 more elements
A semiconductor device package, comprising:
- a substrate having a cavity;
- a first electronic component having a first surface, the first surface having a recessing portion;
- a second electronic component having a second surface facing the first surface of the first electronic component, the second surface includes a protruding portion within the recessing portion of the first surface of the first electronic component;
- and
- a filler inside the cavity and surrounding the first electronic component and the second electronic component;
- wherein the first electronic component and the second electronic component are combined and accommodated in the cavity;
- wherein the first surface of the first electronic component is in contact with the second surface of the second electronic component to define an interface therebetween;
- wherein the filler is outside of the interface;
- and
- wherein the substrate has a top surface and a bottom surface opposite to the top surface, the first electronic component has a third surface opposite to the first surface of the first electronic component, and the second electronic component has a fourth surface opposite to the second surface of the second electronic component, wherein the third surface of the first electronic component is substantially coplanar with the top surface of the substrate, and wherein the fourth surface of the second electronic component is substantially coplanar with the bottom surface of the substrate.
7 more elements
Dependencies are inferred from the claim text.