Backlight module and manufacturing method thereof, and display device
AssigneeWuhan China Star Optoelectronics Technology Co., Ltd.
InventorYong Yang
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Abstract
The present disclosure provides a backlight module, a manufacturing method thereof, and a display device. The backlight module including a substrate, a plurality of LED chips disposed on the substrate, a plurality of encapsulation units encapsulating the LED chips in a one-to-one correspondence; each of the encapsulation units includes at least two encapsulation layers, an innermost one of the encapsulation layers completely covers the LED chip, and a refractive index of an encapsulation layer far from the LED chip is less than a refractive index of an encapsulation layer near the LED chip.
Claims10
A backlight module, comprising:
- a substrate;
- a plurality of LED chips disposed on the substrate;
- and
- a plurality of encapsulation units encapsulating the LED chips in a one-to-one correspondence, each of the encapsulation units comprises at least two encapsulation layers, wherein an innermost one of the encapsulation layers completely covers the LED chip, and a refractive index of the encapsulation layer far from the LED chip is less than a refractive index of the encapsulation layer near the LED chip;
- wherein the encapsulation layer comprises a light-exiting surface, the light-exiting surface is a curved surface;
- and
- in two adjacent encapsulation layers, an outer one of the two adjacent encapsulation layers covers the light-exiting surface of an inner one of the two adjacent encapsulation layers, wherein a radian of the light-exiting surface of the inner one of the encapsulation layers is greater than a radian of curvature of the light-exiting surface of the outer one of the encapsulation layers.
A method of manufacturing a backlight module, comprising:
- providing a substrate;
- arranging a plurality of LED chips on the substrate;
- and
- forming encapsulation units on the LED chips by dispensing, spraying, or coating;
- wherein each of the encapsulation units individually encapsulates a corresponding LED chip, at least two encapsulation layers are sequentially formed on each of the LED chips from an inside to an outside, and a refractive index of the encapsulation layer far from the LED chip is less than a refractive index of the encapsulation layer near the LED chip;
- wherein the encapsulation layer comprises a light-exiting surface, the light-exiting surface is a curved surface;
- and
- in two adjacent encapsulation layers, an outer one of the two adjacent encapsulation layers covers the light-exiting surface of an inner one of the two adjacent encapsulation layers, wherein a radian of the light-exiting surface of the inner one of the encapsulation layers is greater than a radian of curvature of the light-exiting surface of the outer one of the encapsulation layers.
Dependencies are inferred from the claim text.