Electronic system, die assembly and device die

A die assembly, comprising:

• a pair of device dies stacked in a stepped configuration, wherein at least one of the device dies comprises:
• a package having a functional surface;
• a pair of transfer pads disposed on the functional surface of the package, wherein the transfer pads are divided into a plurality of segments electrically isolated from each other;
• and
• at least one conductive trace disposed on the functional surface of the package to mechanically and electrically connect one segment in one transfer pad to one segment in another transfer pad,
• wherein the device dies are mechanically and electrically coupled to each other by an interconnect comprising a wire attached to the segment of one of the transfer pads in two of the device dies by ball bonding.

An electronic system, comprising:

• a supporting member comprising at least one metallic layer;
• and
• a plurality of device dies disposed on the supporting member and mechanically and electrically coupled to the metallic layer by a plurality of conductive strings, wherein at least one device die comprises:
• a package having a functional surface;
• and
• a pair of transfer pads disposed on the functional surface of the package, wherein the transfer pads are divided into a plurality of segments electrically isolated from each other;
• and
• at least one conductive trace disposed on the functional surface of the package to mechanically and electrically connect one segment in one transfer pad to one segment in another transfer pad,
• wherein the device dies are mechanically and electrically coupled to each other by interconnects comprising a wire attached to one of the transfer pads in two of the device dies by ball bonding.