Semiconductor device package

An electronic device, comprising:

• a redistribution layer;
• a logic chip on the redistribution layer;
• a stack of memory chips next to the logic chip on the redistribution layer, the memory chips are stacked in a vertical direction and connected to one another through through-silicon vias (TSVs);
• and
• a molding surrounding a sidewall of the logic chip and a sidewall of the stack of memory chips;
• a heat dissipation structure on a top surface of the logic chip;
• and
• a thermal interface material (TIM) layer between the top surface of the logic chip and the heat dissipation structure, wherein:
• the molding does not cover the top surface of the logic chip, and the TIM layer covers the top surface of the logic chip,
• the molding does not cover a top surface of an uppermost memory chip of the stack of memory chips, and the TIM layer does not extend over the top surface of the uppermost memory chip,
• no semiconductor chip is located on the top surface of the uppermost memory chip,
• no semiconductor chip is located on the top surface of the logic chip, and
• no semiconductor chip is located between the logic chip and the redistribution layer.

An electronic device, comprising:

• a redistribution layer;
• an application processor chip on the redistribution layer;
• a stack of DRAM chips next to the application processor chip on the redistribution layer, the DRAM chips are connected to one another through through-silicon vias (TSVs);
• a molding extending in a vertical direction along a sidewall of the application processor chip and along a sidewall of the stack of DRAM chips;
• and
• a heat dissipation structure on a top surface of the application processor chip, wherein:
• a top surface of the molding, the top surface of the application processor chip, and a top surface of an uppermost DRAM chip of the stack of DRAM chips are coplanar,
• no semiconductor chip is located on the top surface of the uppermost DRAM chip, and
• the heat dissipation structure extends, in a horizontal direction perpendicular to the vertical direction, beyond outermost sidewalls of the molding so that the outermost sidewalls of the molding do not contact the heat dissipation structure in the horizontal direction.