Methods for bonding substrates

A nontransitory computer readable storage medium having stored thereon instructions that when executed by a processor perform a method for bonding substrates, the method comprising:

• performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate;
• performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate;
• positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate;
• and
• bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate,
• wherein bonding the first substrate to the second substrate is performed at a temperature not exceeding 250° C.

A method for bonding substrates, comprising:

• performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate and form a bonding interface on each of the first substrate and the second substrate;
• after performing ECD, performing chemical mechanical polishing (CMP) on the first substrate and the second substrate such that the formed bonding interface on each of the first substrate and the second substrate has a thickness not exceeding 100 nm;
• positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate;
• and
• bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.