Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

A method for manufacturing at least one electronic module, the method comprising:

• applying a first adhesion layer at least to an entire component mounting area of a conductive first substrate;
• direct or indirect mounting of a first main surface of a plurality of electronic chips on a respective partial region of the first adhesion layer;
• applying a second adhesion layer on a conductive second substrate;
• direct or indirect mounting of a second main surface of the plurality of electronic chips on a respective partial region of the second adhesion layer;
• converting at least one of the first adhesion layer and the second adhesion layer to a dielectric layer;
• and
• singularizing of the plurality of electronic chips between the first substrate and the second substrate to a plurality of electronic modules, wherein each electronic module comprises at least a section of the first substrate, a section of the first adhesion layer wherein edges of the first adhesion layer are exposed, a section of the second adhesion layer wherein edges of the second adhesion layer are exposed, a section of the second substrate, and at least one electronic chip.

A method for manufacturing at least one electronic module, the method comprising:

• applying a first adhesion layer at least to an entire component mounting area of a conductive first substrate, wherein the first adhesion layer has a constant thickness throughout, except of the region where an electrical contacting is arranged;
• direct or indirect mounting of a first main surface of a plurality of electronic chips on a respective partial region of the first adhesion layer;
• applying a second adhesion layer on a conductive second substrate, wherein the second adhesion layer has a constant thickness throughout, except of the region where an electrical contacting is arranged;
• converting the first adhesion layer and the second adhesion layer to dielectric layers;
• and
• direct or indirect mounting of a second main surface of the plurality of electronic chips on a respective partial region of the second adhesion layer.